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|
Package Type |
Package Size |
Ball/Lead Pitch |
Ball Size |
|
60B wBGA |
8x10x1.2(Max.) |
0.8mm |
0.45mm |
|
8x10.5x1.2(Max.) |
0.8mm |
0.45mm |
|
|
9x11.5x1.2(Max.) |
0.8mm |
0.45mm |
|
|
84B wBGA |
8x12.5x1.2(Max.) |
0.8mm |
0.45mm |
| Package Type | Package Size | Ball Size | Ball/Lead pitch |
|
78B wBGA |
7.5x11x1.2(Max.) |
0.45mm |
0.8mm |
|
8x10.5x1.2(Max.) |
0.45mm |
0.8mm |
|
|
9x10.5x1.2(Max.) |
0.45mm |
0.8mm |
|
|
9x11.1X1.2(Max.) |
0.45mm |
0.8mm |
|
|
9.4x11.1X1.2(Max.) |
0.45mm |
0.8mm |
|
|
10.5x12x1.2(Max.) |
0.45mm |
0.8mm |
|
|
78B FCBGA |
9x10.5x1.2(Max.) |
0.45mm |
0.8mm |
|
96B wBGA |
9x13x1.2(Max.) |
0.45mm |
0.8mm |
|
Package Type |
Package Size |
Ball Size |
Ball/Lead pitch |
|
78B wBGA |
8x12x1.2(Max.) |
0.45mm |
0.8mm |
|
9x10.5x1.2(Max.) |
0.45mm |
0.8mm |
|
|
78B wBGA |
9x13x1.2(Max.) |
0.45mm |
0.8mm |
|
9x14x1.2(Max.) |
0.45mm |
0.8mm |
|
Product Type |
Package Type |
Package Size |
Ball Size |
Ball/Lead pitch |
|
LPDDR2 |
162B FBGA |
12x12x1.1(Max.) |
0.3/0.35mm |
0.5mm |
|
LPDDR4 |
200B FBGA |
10x14.5x0.85(Max.) |
0.3mm |
0.8x0.65mm |
| Product Type | Package Type | Package Size | Ball Size | Ball/Lead pitch |
|
eMMC |
153B FBGA |
11.5x13x1.0(Max.) |
0.3mm |
0.5mm |
|
MCP |
162B FBGA |
11.5x13x1.0(Max.) |
0.3mm |
0.5mm |
|
9x11.5x1.0(Max.) |
0.3mm |
0.5mm |
||
|
8x10.5x1.0(Max.) |
0.3mm |
0.5mm |
||
|
11.5x13x1.0(Max.) |
0.3mm |
0.5mm |
|
Product Type |
Package Type |
Package Size |
Ball Size |
Ball/Lead pitch |
|
NAND |
48 TSOP |
12x18.4x1.0mm |
- |
0.5mm |
|
63B FBGA |
10.5x13x1.0mm |
0.45mm |
0.8mm |
|
|
132B FBGA |
12x18x1.1mm |
0.45mm |
1.0mm |
|
|
12x18x1.4mm |
||||
|
13x18x1.1mm |
||||
|
13x18x1.4mm |
||||
|
152B FBGA |
14x18x1.0mm |
0.45mm |
1.0mm |
|
|
14x18x1.4mm |
||||
|
272B FBGA |
14x18x1.4mm |
0.45mm |
0.8mm |
|
|
UDP |
11.3x24.8x1.4mm |
- |
- |
|
|
Micro SD |
11x15x1.1mm |
- |
- |
|
|
Nano Memory |
8.8x12.3x0.78mm |
- |
- |
|
|
SIP - USB |
11.1x16x1.11mm |
- |
- |
|
|
11.1x18x1.11mm |
| Product Type | Package Type | Package Size | Ball Size | Ball/Lead pitch |
| Logic | 130B FBGA | 8x9x1.0/1.05(Max.) | 0.30mm | 0.65mm |
| 144B FBGA | 10x10x1.2(Max.) | 0.35mm | 0.80mm | |
| 324B FCCSP | 15x15x2.0(Max.) | 0.45mm | 0.80mm | |
| 484B FCCSP | 19x19x2.0(Max.) | 0.45mm | 0.80mm |
8D
16D
TJS's professional Test R&D Team focus on program development, hardware design and automated integration, etc.
① Program Coding
② Hardware Design -> Burn-In Board | Hifix/DSA | LoadBoard | Socket | Change Kit
③ Automation Integration
Test Platform
